Technical Specifications:
Features
- Fully Automated From Cleaning to Drying
- Unique Conveyor Cell Plating System
- Approx. 140 Foot Oval Layout.
- High Output Low Effluent System
- Built in Ventilation
Key Characteristics
- Provides Significant Capacity and Throughput vs. Conventional Line with Low Effluent. Reduces Labor Costs
- Very Consistent Process >.05% Rejects
- Very Even Gold Distribution
- Fast Deposition Rates
Durable Construction
High Quality Electronics
Process Steps
Load |
Notes |
Acid |
Notes |
| Ultrasonic | DI Rinse | ||
| Rinse | 2 Acid Gold’s | 1 or 2 cells Activated | |
| Electro | Manual Rev. | Reclaim | |
| Clean Rinse | Rinse | ||
| Electrolytic Acid Dip | Can be Copper Plate | Cyanide Dip | |
| Rinse | Rinse | ||
| 4 Nickel Cells | Electronically activate 1 or all 4 cells | Color Gold | ATX Color |
| Rinse | DI Rinses | Blow Down | |
| Activator | Mist (Boric Acid) | Dryer | X-ray on line |
Top View Layout
Additional Pictures
